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Differences between epoxy, phenolic and silicone

发布时间:2021-09-22 17:43:40人气:

Epoxy resin is a kind of high molecular polymer, its molecular formula is (CHO), which refers to a kind of polymer with more than two epoxy groups in its molecule, and it is the polycondensation product of epichlorohydrin and bisphenol A or polyol. Phenolic resin, also known as bakelite, was originally colorless or yellow-brown transparent, resistant to weak acid and weak base, decomposed in case of strong acid, corroded in case of strong base, and insoluble in organic solvents such as acetone and alcohol. Silicone resin is a thermosetting polysiloxane polymer with highly crosslinked structure, which has the dual characteristics of organic resin and inorganic material, and its weatherability is better than that of ordinary organic resin. 


Differences between epoxy resin、phenolic resin and silicone resin(图1)


Epoxy resin, silicone resin and phenolic resin are three kinds of encapsulating materials. Epoxy resin is generally used for encapsulating temperature-measuring thermistors and encapsulating temperature sensors, and the best temperature is below 150℃. Silicone resin is usually used for thermistors and temperature sensors with high temperature. Phenolic resin is the encapsulation of thermistor used for restraining inrush current and temperature compensation, and the service temperature cannot exceed 175℃.

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